Editor’s Note The COVID-19 pandemic has forced a delay in the crucial standardization work that would make 5G available for enterprise use cases. The relevant standardization body, 3GPP, has formally announced a deferral of this standardization until at least June 2020, which would delay commercial rollout of industrial 5G until at least 2022. Given that most industrial enterprises are looking to upgrade their communication technology in 2021, this delay will result in 5G missing out on at least 25% of the revenue opportunities within industrial enterprises, which given the importance of industrial use cases for overall 5G revenues, this translates
All components shelf life depends on storage conditions and type of packaging. The main concerns with the storage of SMT passive components is humidity content, temperature, and tape & Reel degradation which could ultimately affect solderability. QUESTIONS?
What are Whiskers? “Whiskers” are protrusions that grow from a metal film over time. They can achieve high aspect ratios, growing to considerable lengths and may result in electrical interconnection of adjacent terminals. This can happen when a whisker grows from one terminal to another, as in the case of fine pitch electronics, or when a whisker grows, then shears from its source and lands between two terminals interconnecting them electrically. While this is rare, it has caused considerable concern in the electronics community. Sn Whiskers Tin whiskers are Sn protrusions that grow from a tin film. They may occur
SMT Chips and Shelf LifeHave you ever wondered why that chip component sitting in your inventory has a shelf life? These capacitors, resistors and inductors are made mostly with ceramic materials that definitely don’t spoil! After all, reliability testing predicts that these products should last for years (sometimes hundreds, if not thousands) in service. So why does the manufacturer recommend that you use them within 6 to 18 months of the date of manufacture? Well, it comes down to solderability. Manufacturers explain that the chip finish (e.g. tin) oxidizes over time and thus becomes less solderable. While that’s true, it’s
Chip Components and Surface Mounting Trillions of electronic chip components are installed within electronic assemblies every year using surface mount technology (SMT). Your smartphone, HDTV, car, etc., contain hundreds, if not thousands, of electronic devices assembled using SMT. The SMT process is simple, but highly refined, involving the precise location electronic components onto patterned solder paste deposits on a printed wiring board (PWB), using a pick and place (PnP) machine. The assembly is then heated, in order to flow the solder, and then cooled to achieve physical and electrical interconnects between each terminal of each component and the PWB circuit.